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Problems needing attention in metal etching production

Author: Source: Date:2019/11/28 16:54:11
Information digest:
Problems needing attention in metal etching production

Problems needing attention in metal etching production

First, reduce side erosion and protruding edge and improve etching coefficient

Lateral erosion produces protrusions.Usually, the longer the printed board is in the etching solution, the more serious the side erosion is (or using the old swing etcher).Side erosion seriously affects the accuracy of printed wire, serious side erosion will make it impossible to make fine wire.When the lateral etching and protruding edge decrease, the etching coefficient increases. The high etching coefficient indicates the ability to maintain the thin wire, making the etched wire close to the original size.Electroplating etching resist whether it is tin-lead alloy, tin, tin-nickel alloy or nickel, excessive protrusions will lead to short circuit.Because protruding edges tend to break down, an electrical bridge is formed between two points in the wire.

Second, improve the consistency of etching rate between plates

In continuous plate etching, the more consistent the etching rate is, the more evenly etched plates can be obtained.To achieve this requirement, ensure that the etching liquid in the whole process of etching always maintain a good etching state.This requires the selection of etching solutions that are easy to regenerate and compensate, and easy to control the etching rate.Choose processes and equipment that provide constant operating conditions and automatic control of various solution parameters.This is achieved by controlling the amount of copper dissolved, PH, concentration of the solution, temperature, and uniformity of the solution flow (spray system or nozzle and nozzle swing).

Third, improve the uniformity of the etching rate on the surface of the whole plate

The uniformity of etching on both sides of the board and on each part of the board surface is determined by the uniformity of etching agent flow on the board surface.In the etching process, the etching rate of the upper and lower plates is often inconsistent.Generally speaking, the etching rate of the lower plate is higher than that of the upper plate.Because of the accumulation of solution on the upper plate, the etching reaction is weakened.The uneven etching of the upper and lower plates can be solved by adjusting the pressure of the upper and lower nozzles.A common problem with etching is that it is very difficult to get all the board surfaces etched clean at the same time. The edge of the board is etched faster than the middle of the board.It is an effective measure to adopt spray system and make the nozzle swing.Further changes can be made by making the spray pressure in the middle and edge of the plate different, plate front and back plate intermittent etching method to achieve the etching uniformity of the entire plate surface.

Improve the ability to process and etch thin copper foil and thin laminate

When etching a thin laminate such as the inner layer of a multilayer plate, the plate tends to wind up on rollers and transfer wheels and cause waste.Therefore, the equipment for etching the inner laminate ensures smooth and reliable handling of the thin laminate.Many equipment manufacturers attach gears or rollers to the etching machine to prevent this from happening.A better approach is to use additional teflon cladding lines that swing from side to side as support for thin laminate transfer.For etchings of thin copper foil (such as 1/2 or 1/4 ounce), be sure not to scratch or scratch.The thin copper foil can't withstand the mechanical disadvantages of etching 1-ounce copper foil. Sometimes even the more severe vibration may scratch the copper foil.

Five, the problem of reducing pollution

Water pollution is a common problem in production, especially in the waste solution produced by the etching of copper.Because copper is combined with ammonia, it cannot be removed by ion exchange or alkali precipitation.Therefore, the use of secondary spray operation method, with no copper added liquid to rinse the board, greatly reduce the discharge of copper.An air knife is then used to remove excess solution from the surface before rinsing with water, thus reducing the rinsing burden of water on the copper and etched salts.

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