In addition to the need to pay attention to environmental problems in the process of metal etching, what also need to pay attention to?

The main influencing factors in the process of metal etching are acid, alkali and ferric chloride.So in addition to the environmental factors to pay attention to, there are also some other factors to pay attention to, the following zhuolida xiaobian to explain for you.

Reduce the side erosion and protrusion of metal etching and improve the etching coefficient

Lateral erosion produces protrusions.Usually, the longer the printed board is in the etching solution, the more serious the side erosion is (or using the old swing etcher).Side erosion seriously affects the accuracy of printed wire, serious side erosion will make it impossible to make fine wire.When the lateral etching and protruding edge decrease, the etching coefficient increases. The high etching coefficient indicates the ability to maintain the thin wire, making the etched wire close to the original size.Electroplating etching resist whether it is tin-lead alloy, tin, tin-nickel alloy or nickel, excessive protrusions will lead to short circuit.Because protruding edges tend to break down, an electrical bridge is formed between two points in the wire.

To improve the consistency of etching rate between plates

In continuous plate etching, the more consistent the etching rate is, the more evenly etched plates can be obtained.To achieve this requirement, it is necessary to ensure that the etching liquid in the whole process of etching always maintain a better etching state.This requires the selection of etching solutions that are easy to regenerate and compensate, and easy to control the etching rate.Choose processes and equipment that provide constant operating conditions and automatic control of various solution parameters.This is achieved by controlling the amount of copper dissolved, PH, concentration of the solution, temperature, and uniformity of the solution flow (spray system or nozzle and nozzle swing).

To improve the uniformity of the etching rate on the surface of the whole plate

The uniformity of etching on both sides of the board and on each part of the board surface is determined by the uniformity of etching agent flow on the board surface.In the etching process, the etching rate of the upper and lower plates is often inconsistent.Generally speaking, the etching rate of the lower plate is higher than that of the upper plate.Because of the accumulation of solution on the upper plate, the etching reaction is weakened.The uneven etching of the upper and lower plates can be solved by adjusting the pressure of the upper and lower nozzles.A common problem with etched boards is that it is difficult to etch all surfaces clean at the same time. The edge of the board is etched faster than the center of the board.It is an effective measure to adopt spray system and make the nozzle swing.By making the spray pressure in the middle of the plate and the edge of the plate different, plate front and plate back end of the method of intermittent etching, achieve the etching uniformity of the whole plate surface.

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